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Journal of Shanghai University（Natural Science Edition） ›› 2011, Vol. 17 ›› Issue (4): 391-400.doi: 10.3969/j.issn.1007-2861.2011.04.007

• Mechatronics Engineering and Automation • Previous Articles     Next Articles

Interconnection Technology for HighDensity Chip Packaging

ZHANG Jian-hua1,2，ZHANG Jin-song1,2，HUA Zi-kai1,2   

  1. (1. School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China;2. Key Laboratory of Advanced Display and System Applications of Ministry of Education, Shanghai University, Shanghai 200072, China)
  • Online:2011-08-30 Published:2011-08-30

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Abstract: The trend of electronic packaging is towards highdensity to meet market requirements on electronic products with high performance, high reliability, low cost and miniaturization. Multidiscipline interaction is a notable feature in highdensity packaging, which motivates the research in the lab in the past 10 years. The work of the lab is largely related to the interconnection technologies, i.e., flip chip (FC), bumping, anistropically conductive adhesive film (ACF) and nonconductive adhesive film (NCF), and reliability. The results have been widely applied in the electronic packaging industry. Development trends of high density packaging are also discussed.

Key words: anistropically conductive adhesive film (ACF), bumping, flip chip (FC), highdensity packaging, interconnection technology, nonconductive adhesive film (NCF), reliability

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