[1]安利全,郑建明.小尺寸封装(SOP)器件焊点可靠性研究[J].航天制造技术,2009,2(1):10-13.[2]张莎莎,张亦杰,马乃恒,等.Sn-Ag-Cu 系无铅焊料性能研究进展[J].热加工工艺,2010,39(1):124-127.[2]〖JP2〗LEE N C. Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies [M]. Boston: Newnes, 2002:12-23.[4]LAU J, GOLWALKAR S, ERASMUS S, et al. Experimental and analytical studies of 28pin thin small outline package(TSOP) solderjoint reliability[C]∥ American Society of Mechanical Engineers. 1992:114-117.[5]LAU J, GOLWALKAR S, ERASMUS S. Advantages and disadvantages or thin small outline packages (TSOP) with copper gullwing leads [C]∥ International Electronic Packaging Conference. 1993:9-17.[6]肖克来提,杜黎光,孙志国,等.SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化[J].金属学报,2001,37(4):439-444.[7]黄福祥,马莒生,朱继满,等.引线框架材料对铜合金与锡铅焊料界面组织的影响[J].电子元件与材料,2003,22(4):225-229.[8]常俊玲.功率器件无铅焊料焊接层可靠性研究[D].上海:中国科学院上海微系统与信息技术研究所,2005:30.[9]孙越,冯春娟,冯雪艳.设计SMT焊盘的若干经验[J].信息技术,2001,31(5):33-37.[10]张睿竑,赵然,郭福.Cu基板表面镀镍浸金保护层对无铅焊点可靠性的影响[J].材料研究学报,2010,24(2):137-143. |