上海大学学报(自然科学版)

• 材料科学与工程 • 上一篇    下一篇

Ag80(WC70TiC30)17C3银基电接触材料化学镀的反应动力学

张晓燕,任海峰,高利聪,曹泽淳

  

  1. 上海大学 材料科学与工程学院,上海 200072

  • 收稿日期:2007-06-22 修回日期:1900-01-01 出版日期:2008-10-23 发布日期:2008-10-23
  • 通讯作者: 张晓燕

Electroless Plating Kinetics of Ag80(WC70TiC30)17C3 Silver-Based Electric Contact Material

ZHANG Xiao-yan,REN Hai-feng,GAO Li-cong,CAO Ze-chun   

  1. School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China
  • Received:2007-06-22 Revised:1900-01-01 Online:2008-10-23 Published:2008-10-23
  • Contact: ZHANG Xiao-yan

摘要: 探讨银基电接触材料化学镀银反应过程中的动力学,利用酸度计测量反应过程中的pH值,从而直观地表示了化学镀银反应的速率.通过研究pH值随时间的变化规律,推导出了化学镀银反应动力学方程c=c0e-kt及反应的活化能Ea.

关键词: 动力学, 化学镀, 银基电接触材料

Abstract: This paper introduces the chemical dynamics mechanism during an electroless plating process of silver on the mixture of WC, TiC, C powders. The reaction rate of electroless plating is determined by the pH value. A kinetic equation is derived from the curves of pH measurements versus time at different temperat
ures, i.e. c=c0e-kt.

Key words: electroless plating, kinetics, silver-based electric contact material

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