上海大学学报(自然科学版) ›› 2015, Vol. 21 ›› Issue (1): 28-37.doi: 10.3969/j.issn.1007-2861.2014.04.016

• 冶金材料 • 上一篇    下一篇

烧结温度和粒度分布对多孔氧化硅陶瓷型芯材料性能的影响

徐子烨, 玄伟东, 张金垚, 任忠鸣, 王欢,马晨凯, 杨帆, 余建波, 李传军   

  1. 上海大学 材料科学与工程学院 上海市现代冶金和材料制备重点实验室, 上海 200072
  • 收稿日期:2015-01-07 出版日期:2015-02-28 发布日期:2015-02-28
  • 通讯作者: 任忠鸣(1958—), 男, 教授, 博士生导师, 博士, 研究方向为高温合金精密铸造技术、单晶凝固技术、陶瓷芯制备技术, 以及金属凝固、电磁场下冶金与材料制备等. E-mail:zmren@shu.edu.cn
  • 基金资助:

    国家重点基础研究发展计划(973计划)资助项目(2011CB610404); 国家自然科学基金青年科学基金资助项目(51401116); 上海市科委重点资助项目(13521101102, 14521102900)

Effect of sintering temperature and particle size on properties of porous silicon oxide ceramic core materials

XU Zi-ye, XUAN Wei-dong, ZHANG Jin-yao, REN Zhong-ming, WANG Huan,MA Chen-kai, YANG Fan, YU Jian-bo, LI Chuan-jun   

  1. Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China
  • Received:2015-01-07 Online:2015-02-28 Published:2015-02-28

摘要: 采用热压注法制备了纯氧化硅多孔陶瓷型芯材料样品, 研究了烧结温度和陶瓷粉末粒度分布对陶瓷材料烧结后的组织和性能的影响. 结果表明, 随着烧结温度的升高, 样品的气孔率逐步降低, 室温和高温抗弯强度均相应提高. 当烧结温度为1 200°C时, 烧结收缩率为2.75%, 气孔率为24.69%, 室温抗弯强度达到25.3 MPa, 高温抗弯强度达到44.23 MPa; 当烧结温度超过1 200°C时, 室温和高温抗弯强度均明显降低, 而收缩率和气孔率变化不明显. 通过样品断口形貌和相应物相分析发现, 不同烧结温度下样品致密度和方石英含量的不同是造成陶瓷型芯室温和高温抗弯强度变化的主要原因, 而粒度分布能够显著影响型芯材料的气孔率、收缩率和抗弯强度. 在本实验中, 具有如下粒度分布的型芯材料的综合性能最佳: 10 μm以下约为25.33%, 10∽30 μm约为38.16%, 30∽50 μm约为28.74%, 50 μm以上约为7.77%, 最大粒径不超过95 μm.

关键词: 方石英, 抗弯强度, 气孔率, 烧结温度, 氧化硅陶瓷型芯

Abstract: Samples of porous silicon oxide ceramic core were prepared using a heat-press molding method. The effects of different sintering temperatures and particle sizes on the structures and properties of the porous silicon oxide ceramic core were investigated. The result indicates that, as sintering temperature increases, the room temperature bending strength and high temperature bending strength increase and the porosity decreases. When the sintering temperature is 1 200°C, silicon oxide ceramic core shows the best overall performance for linear shrinkage rate of 2.75%, porosity of 24.69%, room temperature bending strength of 25.3 MPa and the high temperature bending strength of 44.23 MPa. Above 1 200°C, the room temperature bending strength and high temperature bending strength decrease obviously, while linear shrinkage rate and the porosity are stable. According to X-ray diffraction (XRD) patterns and scanning electron microscope (SEM) fracture micrographs of the silicon oxide ceramic core, changes of the room temperature bending strength and high temperature bending strength are attributed to the differences of the compactness and cristobalite content at different sintering temperatures. In addition, the particle size of ceramic core has visible effects on porosity, linear shrinkage rate, and room temperature bending strength. The best overall property of the ceramic core occurrs when 25.33% of the particle sizes are less than 10 μm, 38.16% between 10 μm and 30 μm, 28.74% between 30 μm and 50 μm, and 7.77% greater than 50 μm but no more than 95 μm.

Key words: bending strength, cristobalite, porosity, silicon oxide ceramic core, sintering temperature

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