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Journal of Shanghai University >

2015 , Vol. 21 >Issue 1: 38 - 45

DOI: https://doi.org/10.3969/j.issn.1007-2861.2014.01.028

Metallurgical Materials

Epoxy resin modified by novel polyphenylene ether

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  • 1. School of Material Science and Engineering, East China University of Science and Technology, Shanghai 200237, China; 2. Shanghai Key Laboratory of Advanced Polymeric Materials, Shanghai 200237, China; 3. School of Environmental and Chemical Engineering, Shanghai University, Shanghai 200444, China

Received date: 2013-11-25

  Online published: 2015-02-28

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Abstract

As a curing agent and modified agent of epoxy resin, modified polyphenylene ether (MPPE) containing hydroxyl group was synthesized, and characterized by Fourier transform infrared spectroscopy (FTIR). The properties of MPPE/E51 were investigated, and the following results were obtained. The curing temperature is gradually decreased with the increase of content of E51. Thermal stability of the epoxy resin thermosets is improved with the maximum Td5% being 385 °C. The laminated sheet of MPPE/E51 has low dielectric constant (3.51, 1 GHz), dielectric loss (0.008 9, 1 GHz) and low water absorption. Impact strength of MPPE/E51 is up to 63.34 kJ/m2.

Key words： dielectric property; epoxy resin; polyphenylene ether (PPE)

Cite this article

DUAN Jia-zhen1,2, YU Ruo-bing1,2, HU Lin1,2, JIAO Zheng3 . Epoxy resin modified by novel polyphenylene ether[J]. Journal of Shanghai University, 2015 , 21(1) : 38 -45 . DOI: 10.3969/j.issn.1007-2861.2014.01.028

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