新型聚苯醚改性环氧树脂

doi:10.3969/j.issn.1007-2861.2014.01.028

Journal of Shanghai University（Natural Science Edition） ›› 2015, Vol. 21 ›› Issue (1): 38-45.doi: 10.3969/j.issn.1007-2861.2014.01.028

• Metallurgical Materials • Previous Articles Next Articles

Epoxy resin modified by novel polyphenylene ether

DUAN Jia-zhen1,2, YU Ruo-bing1,2, HU Lin1,2, JIAO Zheng3

1. School of Material Science and Engineering, East China University of Science and Technology, Shanghai 200237, China; 2. Shanghai Key Laboratory of Advanced Polymeric Materials, Shanghai 200237, China; 3. School of Environmental and Chemical Engineering, Shanghai University, Shanghai 200444, China

Received:2013-11-25 Online:2015-02-28 Published:2015-02-28

Abstract

Abstract: As a curing agent and modified agent of epoxy resin, modified polyphenylene ether (MPPE) containing hydroxyl group was synthesized, and characterized by Fourier transform infrared spectroscopy (FTIR). The properties of MPPE/E51 were investigated, and the following results were obtained. The curing temperature is gradually decreased with the increase of content of E51. Thermal stability of the epoxy resin thermosets is improved with the maximum T_d5% being 385 °C. The laminated sheet of MPPE/E51 has low dielectric constant (3.51, 1 GHz), dielectric loss (0.008 9, 1 GHz) and low water absorption. Impact strength of MPPE/E51 is up to 63.34 kJ/m².

Key words: dielectric property, epoxy resin, polyphenylene ether (PPE)

CLC Number:

TQ 326.53

DUAN Jia-zhen1,2, YU Ruo-bing1,2, HU Lin1,2, JIAO Zheng3. Epoxy resin modified by novel polyphenylene ether[J]. Journal of Shanghai University（Natural Science Edition）, 2015, 21(1): 38-45.

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Epoxy resin modified by novel polyphenylene ether

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