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Journal of Shanghai University >

2011 , Vol. 17 >Issue 1: 100 - 102

DOI: https://doi.org/10.3969/j.issn.1007-2861.2011.

Mathematics.Physics and Chemistry

Influence of Packing Densities on Surface Stress of Gene Chip

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  • (1. Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai 200072, China;
    2. College of Sciences, Shanghai University, Shanghai 200444, China;
    3. Periodicals Agency, Shanghai University, Shanghai 200444, China)

Received date: 2009-08-12

  Online published: 2011-02-28

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Abstract

Nanomechanical behavior of gene chip in labelfree biodetection is studied using the energy method．Considering electrostatic energy, hydration energy and configuration fluctuations of DNA layer as well as mechanical energy of chip, an energy formula is set up. The relation between curvature radius of the neutral axis and surface stress of gene chip is obtained according to the minimum principle of energy. Influence of packing densities on surface stress of gene chip is predicted. Theoretical predictions for surface stress of gene chip are compared with experimental data to validate the presented solutions.

Key words： gene chip; bioenergy; nanomechanics; packing density; surface stress

Cite this article

LI Jing-jing1,2,TAN Zou-qing1,QIN Wei3 . Influence of Packing Densities on Surface Stress of Gene Chip[J]. Journal of Shanghai University, 2011 , 17(1) : 100 -102 . DOI: 10.3969/j.issn.1007-2861.2011.

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