Journal of Shanghai University（Natural Science Edition）
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ZHANG Xiao-yan,REN Hai-feng,GAO Li-cong,CAO Ze-chun
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Abstract: This paper introduces the chemical dynamics mechanism during an electroless plating process of silver on the mixture of WC, TiC, C powders. The reaction rate of electroless plating is determined by the pH value. A kinetic equation is derived from the curves of pH measurements versus time at different temperatures, i.e. c=c0e-kt.
Key words: electroless plating, kinetics, silver-based electric contact material
CLC Number:
TN 405
ZHANG Xiao-yan;REN Hai-feng;GAO Li-cong;CAO Ze-chun. Electroless Plating Kinetics of Ag80(WC70TiC30)17C3 Silver-Based Electric Contact Material[J]. Journal of Shanghai University（Natural Science Edition）.
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URL: https://www.journal.shu.edu.cn/EN/
https://www.journal.shu.edu.cn/EN/Y2008/V14/I5/521
Development of TRIP Steel with Good Weldability and Galvanizing Property
