电子封装正朝着高密度封装的方向发展，以满足市场对高性能、高可靠性、低成本、微型化的电子产品的需求.高密度封装具有多学科交叉的特点.综述课题组多年来在芯片高密度封装互连技术，包括倒装芯片（flip chip,FC）凸点制备/转移技术、导电胶高密度互连技术、叠层芯片封装技术及封装可靠性方面的研究工作，并指出未来高密度封装技术的发展方向.

The trend of electronic packaging is towards highdensity to meet market requirements on electronic products with high performance, high reliability, low cost and miniaturization. Multidiscipline interaction is a notable feature in highdensity packaging, which motivates the research in the lab in the past 10 years. The work of the lab is largely related to the interconnection technologies, i.e., flip chip (FC), bumping, anistropically conductive adhesive film (ACF) and nonconductive adhesive film (NCF), and reliability. The results have been widely applied in the electronic packaging industry. Development trends of high density packaging are also discussed.