为了提高氧化锆陶瓷的抛光效率, 在二氧化硅表面掺杂 Y³⁺ 得到改性磨料. X 射线 光电子能谱 (X-ray photoelectron spectroscopy, XPS) 分析表明, Y 元素以 Y(OH)₃ 的形式 存在于改性磨料中. 扫描电子显微镜 (scanning electron microscope, SEM) 和粒度分析结果 表明, 复合磨料呈球形, 粒度均匀, 无聚集体和 2 次颗粒出现. 与纯胶体二氧化硅磨料相比, 材料去除率 (material removal rate, MRR) 提高了 33% 左右. MRR 增大的原因是掺杂的 Y(OH)₃ 改变了二氧化硅颗粒的 Zeta 电位, 减小了二氧化硅颗粒与氧化锆陶瓷之间的排斥力, 增大了二氧化硅颗粒和氧化锆陶瓷基体之间的接触概率, 导致摩擦系数增大.

To improve the polishing efficiency of zirconia ceramics, Y³⁺ was doped on the surface of silica to obtain modified abrasives. X-ray photoelectron spectroscopy (XPS) analysis showed that the Y element exists in the modified abrasive in the form of Y(OH)₃. Results of scanning electron microscopy (SEM) and particle size analysis showed that the composite abrasives were spherical with a uniform particle size, and no aggregation and secondary particles appeared. Compared with the pure colloidal silica abrasive, the material removal rate (MRR) of the composite abrasives was increased by approximately 33%. It also changes the zeta potential of the silica particles and reduces the repulsion between the silica and zirconia ceramic surface. This increases the contact probability between the silica and zirconia ceramic wafer, resulting in an increase in the coefficient of friction.