通过阴离子诱导辅助生长法制备哑铃形氧化硅磨粒, 并对哑铃形氧化硅磨粒进行表征, 研究该磨粒对氧化锆陶瓷化学机械抛光 (chemical mechanical polishing, CMP) 性能的影响. 实验结果表明: 哑铃形氧化硅磨粒稳定性好、分散性好, 具有优异的化学机械抛光性能. 与球 形氧化硅磨粒相比, 用哑铃形氧化硅磨粒对氧化锆陶瓷抛光时, 材料去除率提高 39%, 抛光后 陶瓷表面平整光滑, 表面粗糙度为 1.960 nm. 这是因为哑铃形氧化硅磨粒抛光液润湿性好, 可 以与氧化锆陶瓷表面充分接触, 有利于固相化学反应的发生. 此外, 哑铃形氧化硅磨粒的摩擦 系数更大, 这使得机械效应显著增强.

In this study, dumbbell-shaped silica abrasives were prepared by an anioninduced assisted growth method and characterized. The effects of the abrasives on the chemical mechanical polishing (CMP) performances of zirconia ceramics were then studied. The results showed that the abrasives had good stability and dispersion and exhibited excellent CMP properties. Compared with spherical silica abrasives, the material removal rate of the dumbbell-shaped silica abrasives increased by 39%, and the surfaces of the zirconia ceramics were flat and smooth following polishing, where the surface roughness was 1.960 nm. This was due to the fact the polishing fluid with the abrasives had good wettability and adequately contacted the surfaces of the zirconia ceramics, which helped to induce solid-phase chemical reactions. In addition, the coefficient of friction of the dumbbell-shaped silica was higher, significantly enhancing the mechanical effect.