上海大学学报(自然科学版) ›› 2025, Vol. 31 ›› Issue (1): 105-114.doi: 10.12066/j.issn.1007-2861.2571

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改进静电植绒法制备沥青基碳纤维垂直排列高导热热界面材料

武美霞1, 欧阳江坤1, 侯梦迪1, 洪建婷2, 丁 鹏1, 王金合1   

  1. 1. 上海大学 纳米科学与技术研究中心, 上海 200444; 2. 上海大学 材料科学与工程学院, 上海 200444
  • 收稿日期:2024-01-11 出版日期:2025-02-28 发布日期:2025-03-03
  • 通讯作者: 王金合 (1982—), 男, 副研究员, 博士生导师, 博士, 研究方向为导热高分子、防火高分子等. E-mail:wangjinhe@shu.edu.cn
  • 基金资助:
    国家自然科学基金资助项目 (52073168)

Fabrication of vertically aligned pitch-based carbon fiber filled thermal interface materials with high thermal conductivity through improved electrostatic flocking method

WU Meixia1, OUYANG Jiangkun1, HOU Mengdi1, HONG Jianting2, DING Peng1, WANG Jinhe1   

  1. 1. Nano-Science & Technology Research Center, Shanghai University, Shanghai 200444, China; 2.School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China
  • Received:2024-01-11 Online:2025-02-28 Published:2025-03-03

摘要: 利用二次静电植绒和底膜收缩的方法, 成功制备致密垂直排列的沥青基碳纤维/硅胶复合热界面材料. 研究了改进静电植绒法对导热材料的密度、垂直度、导热系数及传热效果的影响. 结果显示, 在相同植绒时间下, 二次植绒的沥青基碳纤维植绒密度和垂直排列状态明显优于一次植绒的沥青基碳纤维. 在二次植绒的条件下进行底膜收缩, 当底膜收缩率为 33% 时,热界面材料的垂直导热系数可达 27.4 W/(m·K). 所制备材料展现出良好的垂直导热性能, 所采用的制备工艺具有良好的工业放大可能性, 具有在电子芯片散热领域发展的潜力.

关键词: 改进静电植绒, 热界面材料, 沥青基碳纤维 (pitch-based carbon ?ber, PCF), 垂直排列

Abstract: : A method involving secondary electrostatic flocking was used to prepare a ver-tically aligned array of pitch-based carbon fibers. The effects of the improved electrostatic flocking method on the density, perpendicularity, thermal conductivity, and heat trans-fer of the thermally conductive materials filled with pitch-based carbon fiber arrays were studied. The results show that pitch-based carbon fibers prepared with secondary flocking exhibited a significantly improved density and vertical alignment compared with those prepared with one-time flocking under the same flocking time. Additionally, when the film was contracted by 33%, the thermal interface material achieved a high vertical thermal conductivity of 27.4 W/(m·K). The material exhibited a good vertical thermal conductivity, and the preparation process shows great promise for industrial scalability and potential applications in the field of electronic chip heat dissipation.

Key words: improved electrostatic ?ocking, thermal interface material, pitch-based carbon ?ber (PCF), vertically aligned

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