上海大学学报(自然科学版) ›› 2013, Vol. 19 ›› Issue (6): 551-555.doi: 10.3969/j.issn.1007-2861.2013.06.001

• 材料科学与工程 •    下一篇

光纤光栅传感器高温粘接失效机理实验

杜翀, 彭焘, 霍施宇, 解维华, 孟松鹤   

  1. 哈尔滨工业大学 复合材料与结构研究所, 哈尔滨 150080
  • 出版日期:2013-12-30 发布日期:2013-12-30
  • 通讯作者: 解维华(1978—), 男, 副教授, 博士, 研究方向为热防护优化设计和测试评价、 结构健康监测. E-mail:michael@hit.edu.cn
  • 作者简介:解维华(1978—), 男, 副教授, 博士, 研究方向为热防护优化设计和测试评价、 结构健康监测.
  • 基金资助:

    国家自然科学基金资助项目(11272107, 91016029, 91216302)

Experiment of Failure Mechanism of High Temperature Bonded Fiber Grating Sensor

DU Chong, PENG Tao, HUO Shi-yu, XIE Wei-hua, MENG Song-he   

  1. Centre for Composite Materials and Structures, Harbin Institute of Technology, Harbin 150080, China
  • Online:2013-12-30 Published:2013-12-30

摘要: 随着耐受温度的不断提高, 高温光纤光栅在高温热结构领域的应用潜力愈发明显. 高温粘接是一种实现光纤光栅传感器应用的最简单有效的方法, 但高温环境使得高温粘接存在多种失效的可能. 通过高温拉伸和剪切实验研究了光纤光栅传感器与超高温陶瓷粘接的粘接性能, 结合断口的宏微观形貌观察研究了高温粘接的失效机理. 研究结果表明: 当温度为 500 和 650 ℃ 时, 粘接破坏是包含界面破坏和粘接剂内聚力破坏的混合破坏模式, 并且以粘接剂内聚力破坏为主; 在 800 和 1 000 ℃ 环境下, 粘接失效主要是缘于界面破坏. 在热和力的共同作用下, 粘接剂内部的孔洞逐渐扩展为裂纹, 导致抗拉强度减弱, 而单纯的高温热处理却会提高粘接性能.

关键词: 高温光纤光栅传感器, 高温陶瓷, 高温粘接, 失效机理

Abstract: As the temperature resistance of fiber grating improving, the potential application of the fiber grating sensor in the high temperature thermal structure field is increasingly apparent. The high temperature bonding method is one of the most simple and effective methods to apply fiber grating sensors. However, the
high temperature environment may cause various high temperature adhesive failures. The bonding properties of fiber grating sensor and ultra high temperature ceramic are studied in high temperature tensile and shear experiments, and the high temperature bonding failure mechanisms are studied by macro and micro fracture morphology observations. The results show that the bonding failure is a mixed failure mode including interface damage and cohesive failure at two temperatures 500 and 650  ℃, and mainly adhesive cohesive failure, while at 650 and 800  ℃, bonding failure is mainly interface failure. Under a thermal and mechanical load, holes in the adhesive gradually develop to the crack weakening tensile strength, and simple high temperature heat treatment can improve the bonding performance.

Key words: failure mechanism, high temperature bonding, high temperature fiber grating sensor, ultra high temperature ceramic

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