组合材料芯片技术在Zn-Al合金镀层组分优选中的应用

上海大学学报(自然科学版)

组合材料芯片技术在Zn-Al合金镀层组分优选中的应用

朱丽慧1，朱烁金1，刘茜2，刘庆峰2，王利3

1.上海大学材料科学与工程学院，上海 200072；2.中国科学院上海硅酸盐研究所高性能陶瓷和超微结构国家重点实验室，上海 200050；3.宝山钢铁股份有限公司技术中心，上海 201900

收稿日期:2008-05-08 修回日期:1900-01-01 出版日期:2008-10-23 发布日期:2008-10-23
通讯作者: 朱丽慧

Composition Optimization of Zn-Al Hot-Dip Coatings Using Combinatorial Material Chip Approach

ZHU Li-hui1,ZHU Shuo-jin1,LIU Qian2,LIU Qing-feng2,WANG Li3

1. School of Materials Science and Engineering, Shanghai University, Shanghai 200072, China；2. State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China；3. Technology Center, Baoshan Iron & Steel Co., Ltd., Shanghai 201900, China

Received:2008-05-08 Revised:1900-01-01 Online:2008-10-23 Published:2008-10-23
Contact: ZHU Li-hui

摘要/Abstract

摘要： 组合材料芯片技术是材料研究的一种全新方法，能够高效、快速地筛选、优化新材料.按照组合材料芯片技术筛选结果，具有良好力学和耐蚀性能的Zn-Al合金中Al含量应控制在50%～75％，其中Al含量为72.6%时性能最佳.选择纯锌、55Al-Zn和72Al-Zn三种组分进行热浸镀和耐蚀性比较及机理研究.结果表明，72Al-Zn合金的耐蚀性稍优于55Al-Zn，都明显优于纯锌.这与组合材料芯片技术筛选结果一致，表明该组合材料芯片技术在优选Zn-Al耐蚀合金镀层组分方面是可靠的.

关键词: 耐蚀性, 热浸镀锌, 组合材料芯片技术

Abstract: Combinatorial material chip approach is innovation in materials research. It can discover and optimize new materials efficiently and quickly. Combinatorial material chip approach suggests that Al content should be controlled in the range of 50%~75% for Zn-Al hot-dip coatings with good mechanical properties and anticorrosion behavior. Especially, 72.6Al-Zn has excellent properties. Corrosion behaviors of hot-dip Zn, 55Al-Zn and 72Al-Zn coatings were compared and the corrosion mechanisms were studied. The results show that the anticorrosion property of 72Al-Zn coating is slightly better than 55Al-Zn coating, and both are much better than Zn coating. It indicates that combinatorial material chip approach can be applied for the composition optimization of anticorrosion Zn-Al hot-dip coatings.

Key words: anticorrosion behavior, hot-dip coatings, combinatorial material chip approach

朱丽慧;朱烁金;刘茜;刘庆峰;王利. 组合材料芯片技术在Zn-Al合金镀层组分优选中的应用[J]. 上海大学学报(自然科学版).

ZHU Li-hui;ZHU Shuo-jin;LIU Qian;LIU Qing-feng;WANG Li. Composition Optimization of Zn-Al Hot-Dip Coatings Using Combinatorial Material Chip Approach[J]. Journal of Shanghai University（Natural Science Edition）.

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