采用二苯醚单体合成的含有羟基的新型改性聚苯醚(modified polyphenylene ether, MPPE)可直接作为环氧树脂的固化剂和改性剂. 运用傅里叶变换红外光谱对聚苯醚结构进行了表征, 对MPPE/E51 体系的性能进行了研究. 结果表明: 随着E51 含量的增加, 体系的固化温度降低; 随着MPPE 含量的增加, 体系的热分解温度(Td5%) 明显升高; 当MPPE 含量为E51的2 倍时, MPPE/E51 层压板具有较低的介电常数(3.51, 1 GHz)、介电损耗(0.008 9, 1 GHz) 和吸水率; MPPE/E51 层压板体系具有较高的冲击强度, 最高可达63.34 kJ/m2.
As a curing agent and modified agent of epoxy resin, modified polyphenylene ether (MPPE) containing hydroxyl group was synthesized, and characterized by Fourier transform infrared spectroscopy (FTIR). The properties of MPPE/E51 were investigated, and the following results were obtained. The curing temperature is gradually decreased with the increase of content of E51. Thermal stability of the epoxy resin thermosets is improved with the maximum Td5% being 385 °C. The laminated sheet of MPPE/E51 has low dielectric constant (3.51, 1 GHz), dielectric loss (0.008 9, 1 GHz) and low water absorption. Impact strength of MPPE/E51 is up to 63.34 kJ/m2.
[1] Kim W, Bae J W, Cho I D, et a1. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation [J]. Polymer Engineering and Science, 1999, 39(4): 756-766.
[2] Lin C H, Huang J M, Wang C S. Synthesis, characterization and properties of tetramethyl stilbene-based epoxy resins for electronic encapsulation [J]. Polymer, 2002, 43(10): 2959-2967.
[3] 张续柱, 王严杰. 改性环氧覆铜板高电性能的研究[J]. 纤维复合材料, 2002, 19(1): 33-35.
[4] Singha S, Thomas M J. Dielectric properties of epoxy nanocomposites [J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2008, 15(1): 12-23.
[5] 孟季茹, 梁国正, 何洋, 等. 聚苯醚改性环氧树脂基覆铜板的研制[J]. 复合材料学报, 2003, 20(1): 74-78.
[6] 李爱英, 常杰云. 聚苯醚改性的研究进展与应用[J]. 工程塑料应用, 2011, 39(2): 96-99.
[7] Yoshiyuki I, Anthony J R. Processing of poly(2,6-dimethyl-1,4-phenylene ether) with epoxy resin. 1. reaction-induced phase separation [J]. Macromolecules, 2000, 33(1): 158-166.
[8] 万勇军. 覆铜板用热固性聚苯醚[J]. 热固性树脂, 2001, 16(4): 25-28.
[9] Nunoshige J, Akahoshi H, Shibasaki Y. et a1. Efficient oxidative coupling polymerization for synthesis of thermosetting poly (phenylene ether) copolymer with a low dielectric loss [J]. Journal of Polymer Science Part A: Polymer Chemistry, 2008, 46(15): 5278-5282.
[10] Fukuhara T, Shibasaki Y, Ando S, et a1. Synthesis of thermosetting poly (phenylene ether) containing allyl groups [J]. Polymer, 2004, 45(3): 843-847.
[11] 吕键勇, 孟焱, 何立凡, 等. 超支化聚苯醚对双酚A型环氧树脂的低介电改性[J]. 北京化工大学学报, 2013, 40(4): 41-45.
[12] Huang P Z, Gu A J, Liang G Z, et al. Curing behavior and dielectric properties of hyperbranched poly (phenylene oxide)/cyanate ester resins [J]. Journal of Applied Polymer Science,
2011, 121: 2113-2122.
[13] 吴永胜, 余若冰, 朱长进, 等. 硅烷改性芳基乙炔固化物的耐热性能[J]. 上海大学学报: 自然科学版, 2013, 19(6): 562-566.
[14] 周园, 徐庆玉, 李翔, 等. 聚苯醚的改性及应用[C]// 第十二届中国覆铜板技术市场研讨会. 2011: 221-224.
[15] Wu S J, Lin T K, Shyu S S. Cure behavior, morphology, and mechanical properties of the melt blends of epoxy with polyphenylene oxide [J]. Journal of Applied Polymer Science, 2000, 75(1): 26-34.
[16] 史宜望, 奚慧兰, 龚德昌, 等. KOH催化环氧树脂与丙烯酸反应的动力学研究[J]. 上海大学学报: 自然科学版, 2003, 9(1): 51-54.
[17] 田勇, 王秀芳, 杨卓如. PPE/EP体系的介电性能和耐溶剂性研究[J]. 塑料科技, 2007, 35(8): 66-69.
[18] 田勇, 皮丕辉, 文秀芳, 等. 高性能覆铜板用聚苯醚/环氧树脂体系[J]. 塑料科技, 2006, 34(2): 1-4.
[19] 苏民社, 刘军, 王玉红. 聚苯醚/环氧玻璃布覆铜板的研制[J]. 绝缘材料, 2002(4): 13-15.
