通过实验研究了印刷电路板（print circuit board，PCB）设计对小尺寸薄型封装（thin small outline package，TSOP）焊点可靠性的影响.实验制作了包含引脚焊盘的长度、焊盘的表面处理方式及背靠背的双面贴装偏移量3种设计参数的可靠性测试板，并采用表面贴装工艺（surface mount technology，SMT）将TSOP器件焊接到测试板上;经-40～85 ℃的高低温循环试验后，收集了TSOP引脚焊点裂纹的生长数据;讨论了焊点失效的机理，相应考虑了2种可靠性判断准则，并对各参数条件下的裂纹数据进行比较.结果表明，长尺寸焊盘、有机保焊膜（organic solderability preservatives，OSP）及不对称的两面布置方式有助于提高TSOP引脚的焊点可靠性.
The influence of print circuit board design on solder joint reliability (SJR) of thin small outline package (TSOP) has been investigated in a specifically designed experiment. The SJR test board includes three layout parameters. The TSOP component has been soldered to the test board under surface mount process. Solder joints’ crack length subject to each design parameter has been measured after the samples went through thermal cycling from -40 to 85 ℃. The mechanism of solder joint crack has been discussed. In addition, two judgment criteria are chosen according to the crack length. The results show that SJR of TSOP can be improved by long size pad, organic solderability preservatives (OSP) surface finish and offset double placement.
［1］安利全,郑建明.小尺寸封装（SOP）器件焊点可靠性研究［J］.航天制造技术,2009,2(1):10-13.
［2］张莎莎,张亦杰,马乃恒,等.Sn-Ag-Cu 系无铅焊料性能研究进展［J］.热加工工艺,2010,39(1):124-127.
［2］〖JP2〗LEE N C. Reflow soldering processes and troubleshooting: SMT, BGA, CSP and flip chip technologies ［M］. Boston: Newnes, 2002:12-23.
［4］LAU J, GOLWALKAR S, ERASMUS S, et al. Experimental and analytical studies of 28pin thin small outline package(TSOP) solderjoint reliability［C］∥ American Society of Mechanical Engineers. 1992:114-117.
［5］LAU J, GOLWALKAR S, ERASMUS S. Advantages and disadvantages or thin small outline packages (TSOP) with copper gullwing leads ［C］∥ International Electronic Packaging Conference. 1993:9-17.
［6］肖克来提,杜黎光,孙志国,等.SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化［J］.金属学报,2001,37(4):439-444.
［7］黄福祥,马莒生,朱继满,等.引线框架材料对铜合金与锡铅焊料界面组织的影响［J］.电子元件与材料，2003,22(4):225-229.
［8］常俊玲.功率器件无铅焊料焊接层可靠性研究［D］.上海：中国科学院上海微系统与信息技术研究所,2005:30.
［9］孙越,冯春娟,冯雪艳.设计SMT焊盘的若干经验［J］.信息技术,2001,31(5):33-37.
［10］张睿竑,赵然,郭福.Cu基板表面镀镍浸金保护层对无铅焊点可靠性的影响［J］.材料研究学报,2010,24(2):137-143.
