收稿日期: 2009-08-12
网络出版日期: 2011-02-28
基金资助
国家自然科学基金资助项目(0872121)；上海市自然科学基金资助项目(07ZR14037)；Multiscale Material Mechanics Fellowship；上海大学系统生物研究基金资助项目；国家杰出青年基金资助项目(10725209);上海市重点学科建设资助项目(S30106)
Influence of Packing Densities on Surface Stress of Gene Chip
Received date: 2009-08-12
Online published: 2011-02-28
利用能量法分析无标记生物检测中基因芯片的纳米力学行为.首先，考虑微悬臂梁机械能、基因层静电能、水合能和构型熵，建立基因芯片能量模型;其次，利用能量最小原理，得到芯片稳态弯曲的曲率半径与表面应力之间的关系;最后，预测种植密度对芯片表面应力的影响，同时将预测结果与有关实验数据进行比较，证明该方法的可靠性.
李晶晶1,2,谭邹卿1,秦巍3 . 种植密度对基因芯片表面应力的影响[J]. 上海大学学报(自然科学版), 2011 , 17(1) : 100 -102 . DOI: 10.3969/j.issn.1007-2861.2011.
Nanomechanical behavior of gene chip in labelfree biodetection is studied using the energy method．Considering electrostatic energy, hydration energy and configuration fluctuations of DNA layer as well as mechanical energy of chip, an energy formula is set up. The relation between curvature radius of the neutral axis and surface stress of gene chip is obtained according to the minimum principle of energy. Influence of packing densities on surface stress of gene chip is predicted. Theoretical predictions for surface stress of gene chip are compared with experimental data to validate the presented solutions.
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