收稿日期: 2018-07-09
网络出版日期: 2018-07-10
基金资助
国家自然科学基金资助项目(61674100);国家自然科学基金资助项目(61774101)
Modelling analysis and optimisation of high-speed signal reflection in transmission lines
Received date: 2018-07-09
Online published: 2018-07-10
陈章进, 王文磊, 季渊, 黄舒平 . 传输线中高速信号反射建模分析与优化[J]. 上海大学学报(自然科学版), 2021 , 27(3) : 503 -513 . DOI: 10.12066/j.issn.1007-2861.2171
The point-to-point transmission line is currently the most widely used and basic type of transmission line. Traditional modelling analysis methods are not fully applicable to the analysis of high-speed transmission lines. In this study, the signal reflection phenomenon in point-to-point transmission lines was modelled and analysed, and the effects of the line length and via on the signal reflection in transmission lines were analyzed. Detailed modelling of the impedance matching scheme for the signal reflection and analysis of matching resistors, branch line lengths, vias, and termination voltages in impedance matching was performed. Furthermore, the feasibility of the analytical method was verified through theoretical analysis. The analytical design scheme has been applied to the design of multiple products.
Key words： signal integrity; reflection; high-speed transmission; distributed model
| [1] | Doi Y. Transmission line analysis on high-speed digital interconnection[C]// Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium. 1989: 307-310. |
| [2] | Ahn S Y, Lu A C W, Fan W, et al. Effects of process variation on signal integrity for high speed differential signaling on package level[C]// 4th Electronics Packaging Technology Conference. 2002: 249-252. |
| [3] | Johnson H, Graham M. 高速数字设计 [M]. 沈立, 朱来文, 陈宏伟, 等译.北京: 电子工业出版社, 2010. |
| [4] | Bogatin E. 信号完整性分析 [M]. 李玉山, 李丽平, 译. 北京: 电子工业出版社, 2006. |
| [5] | Beyene W, Juneja N, Hahm Y C, et al. Signal and power integrity analysis of high-speed links with silicon interposer[C]// IEEE Electronic Components and Technology Conference. 2017: 1708-1715. |
| [6] | Poltz J, Wexler A. Cross-talk and ringing on a multilayer PCB[C]// IEEE 1989 National Symposium on Electromagnetic Compatibility. 1989: 347-350. |
| [7] | McNeilly M E. Simulation of ringing and cross-talk on printed circuit boards[D]. Winnipeg: University of Manitoba, 1988. |
| [8] | Kitora S, Abe M, Toki H. Electromagnetic noise in electric circuits: ringing and resonance phenomena in the common mode[J]. AIP Advances, 2014,4(11):094201. |
| [9] | 杨洪军. 信号完整性分析及其在高速 PCB 设计中的应用[D]. 成都: 电子科技大学, 2006. |
| [10] | Paul C R. Introduction to electromagnetic compatibility[M]. Hoboken: John Wiley & Sons, Inc., 2006. |
| [11] | Cheng D K. 电磁场与电磁波 [M]. 何业军, 桂良启, 译. 北京: 清华大学出版社, 2013. |
| [12] | 商世伟. 高速电路设计及其在板级电路中的应用[D]. 上海: 上海交通大学, 2007. |
| [13] | Beyene W, Juneja N, Hahm Y C, et al. Signal and power integrity analysis of high-speed links with silicon interposer[C]// IEEE Electronic Components and Technology Conference. 2017: 1708-1715. |
| [14] | Lee J J, Lee K S. Input buffer circuit: US, US 6943585 B2[P]. 2005-09-13. |
| [15] | 祝大同. 国外 FR-4 基板材料用环氧树脂的发展[J]. 热固性树脂, 1999,14(1):32-38. |
| [15] | Zhu D T. Development of the epoxy resin used for FR-4 basic board abroad[J]. Thermosetting Resin, 1999,14(1):32-38. |
| [16] | Chang W U, Cen F. Analysis of signal integrity for interconnection between FPGA and DDR2 SDRAM[J]. Computer Engineering and Applications, 2011,47(29):158-160. |
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